| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a protection sheet of a semiconductor wafer which improves the adhesion with the semiconductor wafer and prevents grinding water from intruding into the semiconductor wafer. <P>SOLUTION: As shown in FIG. 1, a protection sheet 100 of a semiconductor wafer includes: a base material layer 110, an adhesion layer 120 formed on the base material layer 110, and a slit 130 formed in the adhesion layer 120 and existed in a position that overlaps with an outer periphery of the semiconductor wafer 200 in a plain view. <P>COPYRIGHT: (C)2013,JPO&INPIT |
