| 摘要 |
A semiconductor device manufacturing method includes cutting a resin sealing body into a plurality of pieces, the resin sealing body including a plurality of semiconductor chips mounted on a wiring board, a heat spreader disposed above the plurality of the semiconductor chips, and a sealing resin filled between the wiring board and the heat spreader, wherein the cutting the resin sealing body includes shaving the resin sealing body from a side of the heat spreader, and shaving the resin sealing body from a side of the wiring board, wherein the shaving the resin sealing body from the side of the wiring board is carried out after the shaving from the side of the heat spreader, and wherein the resin sealing body is completely cut off by the shaving from the side of the wiring board, and mounting a group of ball-like electrodes at a back side of the wiring board.
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