发明名称 |
THREE-DIMENSIONAL PACKAGE STRUCTURE |
摘要 |
The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.
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申请公布号 |
US2013001756(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213612852 |
申请日期 |
2012.09.13 |
申请人 |
CYNTEC CO., LTD.;CHEN DA-JUNG;LIU CHUN-TIAO;WEN CHAU-CHUN |
发明人 |
CHEN DA-JUNG;LIU CHUN-TIAO;WEN CHAU-CHUN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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