发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of providing a stable electric property and high reliability to the semiconductor device using an oxide semiconductor. <P>SOLUTION: In a process for manufacturing a bottom-gate structure transistor having an oxide semiconductor film, dehydration or dehydrogenation treatment by heat treatment, and oxygen doping treatment are performed. The transistor having the oxide semiconductor film treated by the dehydration or dehydrogenation treatment by the heat treatment, and treated by oxygen doping treatment in the process for manufacturing, can reduce the amount of change of threshold voltage of the transistor even before and after a bias-thermal stress test (BT test), and has high reliability. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013030785(A) 申请公布日期 2013.02.07
申请号 JP20120192748 申请日期 2012.09.03
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 H01L21/336;G02F1/1368;G02F1/167;G02F1/17;G09F9/30;H01L27/146;H01L29/786;H01L51/50;H05B33/10;H05B33/14 主分类号 H01L21/336
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