发明名称 |
Handling layer for transparent substrate |
摘要 |
A device is provided which includes a transparent substrate. An opaque layer is disposed on the transparent substrate. A conductive layer disposed on the opaque layer. The opaque layer and the conductive layer form a handling layer, which may be used to detect and/or align the transparent wafer during fabrication processes. In an embodiment, the conductive layer includes a highly-doped silicon layer. In an embodiment, the opaque layer includes a metal. In embodiment, the device may include a MEMs device. |
申请公布号 |
US8405169(B2) |
申请公布日期 |
2013.03.26 |
申请号 |
US20100905358 |
申请日期 |
2010.10.15 |
申请人 |
CHENG CHUN-REN;CHANG YI-HSIEN;CHANG ALLEN TIMOTHY;CHEN CHING-RAY;CHU LI-CHENG;LIN HUNG-HUA;HSIEH YUAN-CHIH;CHAO LAN-LIN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHENG CHUN-REN;CHANG YI-HSIEN;CHANG ALLEN TIMOTHY;CHEN CHING-RAY;CHU LI-CHENG;LIN HUNG-HUA;HSIEH YUAN-CHIH;CHAO LAN-LIN |
分类号 |
H01L27/14;H01L21/00 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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