CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: A grease or paste-type curable organopolysiloxane composition is provided to have excellent workability, and to attach a heat-radiant member to an electronic component by being in a grease or paste phase before curing. CONSTITUTION: A grease or paste-type curable organopolysiloxane composition comprises organopolysiloxane which has two or more alkenyl groups coupled to a silicon atom every molecule; two or more organohydrogen polysiloxane which has two or more hydrogen atom coupled to the silicon atom every molecule; gallium and/or an alloy thereof with a melting point of 0-70 deg. C; thermoconductive filler with an average particle diameter of 0.1-100 micron; a platinum-based catalyst; and polysiloxane represented by chemical formula 1. In the chemical formula 1: R^1 is a monovalent hydrocarbon group; R^2 is an alkyl group, alkoxy group, alkenyl group, or acyl group; a is an integer from 5-100; and b is an integer from 1-3.