| 摘要 |
PURPOSE: A semiconductor pressure sensor module is provided to prevent hydraulic pressure from being directly delivered to a semiconductor pressure sensor as the hydraulic pressure to be measured is delivered to the semiconductor pressure sensor via a guide passage which is bend-formed between an inlet and an inlet hole. CONSTITUTION: A semiconductor pressure sensor module comprises a housing unit(20), a semiconductor pressure sensor(30), a joining unit(40), and a protrusion unit(50). The semiconductor pressure sensor is received in a space of the housing unit, thereby detecting the pressure of a fluid. The joining unit protrudes and is formed in one side of the housing unit, and includes a passage communicated with the space. The protrusion unit protrudes and is formed in a front end of the joining unit, and an inlet hole communicated with the passage is formed in the outer periphery of the protrusion unit. |
