THERMAL-CONDUCTIVE SHEET, LED MOUNTING SUBSTRATE, AND LED MODULE

摘要

The present invention provides a thermal-conductive sheet having excellent heat dissipation characteristics, in which a thermal-conductive filler is dispersed in a polymer matrix. The present invention is a thermal-conductive sheet in which a non-spherical thermal-conductive filler is dispersed in a polymer matrix, wherein at least a portion of the thermal-conductive filler is oriented in the thickness direction of the sheet, and when the portion of the thermal-conductive filler that has the highest degree of orientation in the thickness direction of the sheet is the orientation center, and an axis passing through the orientation center and perpendicular to the sheet surface is the central axis of orientation, the thermal-conductive sheet has a portion in which the thermal-conductive filler is oriented toward one point on the central axis of orientation, and the degree of orientation of the thermal-conductive filler in the thickness direction of the sheet decreases progressively toward the peripheral edge of the sheet from the center of orientation.