发明名称 |
ELECTRONIC ELEMENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic element embedded printed circuit board and a method of manufacturing the same. <P>SOLUTION: A printed circuit board comprises: a first substrate in which a cavity is formed; a first electronic element embedded in a face down manner in the cavity; a second electronic element stacked on an upper side of the first electronic element and embedded in a face up manner in the cavity; and second substrates stacked on upper and lower surfaces of the first substrate separately. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013077848(A) |
申请公布日期 |
2013.04.25 |
申请号 |
JP20130013848 |
申请日期 |
2013.01.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LEE JIN-WON;CHUNG YUL-KYO;SOHN SEUNG HYUN;KIM MOON-IL |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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