发明名称 ELECTRONIC ELEMENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic element embedded printed circuit board and a method of manufacturing the same. <P>SOLUTION: A printed circuit board comprises: a first substrate in which a cavity is formed; a first electronic element embedded in a face down manner in the cavity; a second electronic element stacked on an upper side of the first electronic element and embedded in a face up manner in the cavity; and second substrates stacked on upper and lower surfaces of the first substrate separately. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013077848(A) 申请公布日期 2013.04.25
申请号 JP20130013848 申请日期 2013.01.29
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE JIN-WON;CHUNG YUL-KYO;SOHN SEUNG HYUN;KIM MOON-IL
分类号 H05K3/46 主分类号 H05K3/46
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