METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES

摘要

In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal-containing surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula I in which R, R2 and R3 are each independently selected from hydrogen and C-4 alkyl. The base has a boiling point less than 100°C, and the rinse liquid has a p H in the range 1 of 8 to 10.