发明名称 SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD, AND IMAGING UNIT
摘要 <P>PROBLEM TO BE SOLVED: To allow an aperture of a pixel to be widen. <P>SOLUTION: A substrate constituting a solid-state imaging element includes a light-receiving portion for photoelectrically converting light from a subject to store resultant signal charge, and a first transfer electrode to which voltage is to be applied when the signal charge is read from the light-receiving portion, both of which are adjacent to each other. A first light-shielding film is formed in the first transfer electrode so as to partially cover the first transfer electrode, and a second light-shielding film is formed in a portion of a surface of the first light-shielding film. When the signal charge is read, voltage is applied to the first transfer electrode via the first light-shielding film and the second light-shielding film. When a light-shielding film to be formed in the first transfer electrode is formed so as to be divided into the first light-shielding film and the second light-shielding film, the light-shielding film having a desired shape can be easily formed and an aperture of a pixel can be widen. This technique can be applied to an imaging unit. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013084713(A) 申请公布日期 2013.05.09
申请号 JP20110222743 申请日期 2011.10.07
申请人 SONY CORP 发明人 KITANO YOSHIAKI
分类号 H01L27/14;H01L27/148 主分类号 H01L27/14
代理机构 代理人
主权项
地址