| 摘要 |
<p>The objective of the invention is to cool a heat generating component that is in contact with a board. An electronic board unit (20) comprises: a board (34) that is in contact with a heat generating component (36); and a step member (40) that is disposed on the board (34) and that intervenes in the flow path of a cooling air that flows toward a to-be-cooled area (60) where the heat generating component (36) is located. The position, on the board (34), of the step member (40) and the height, from the board (34), of the step member (40) are established such that the cooling air, which has burbled, relative to an end portion (40A) of the step member (40), in the height direction, re-attaches to the to-be-cooled area (60).</p> |
