| 摘要 |
<p>A light emitting diode (LED) package having two vias (101, 102) and one epitaxial (epi) via (102) for electrical connections includes a carrier substrate (100), an LED chip, an epi layer (200), a bonding layer (110), two electrodes (210, 230), two conductors through the vias, two pads (250, 260) on the bottom of the carrier substrate and a passivation layer (240). The two vias are formed through the carrier substrate. The epi layer via is formed through the epi layer and the first electrode. Another LED package having a via and an epi layer via for electrical connections includes sub strate, an LED chip, an epi layer, a bonding layer, two electrodes, two conductors the via, two passivation layers (241, 242) for electrical insulation and two pads on the bottom of the carrier substrate. All electrical connections are formed through the single via and the epi layer via. The two conductors are isolated by the second passivation layer. A</p> |
