发明名称 SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD
摘要 A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.
申请公布号 US2013146228(A1) 申请公布日期 2013.06.13
申请号 US201213693151 申请日期 2012.12.04
申请人 TOKYO ELECTRON LIMITED;TOKYO ELECTRON LIMITED 发明人 HIRAKAWA OSAMU;HONDA MASARU;FUKUTOMI AKIRA;TAMURA TAKESHI;HARADA JIRO;NODA KAZUTAKA
分类号 B32B38/10 主分类号 B32B38/10
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