发明名称 |
SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD |
摘要 |
A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.
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申请公布号 |
US2013146228(A1) |
申请公布日期 |
2013.06.13 |
申请号 |
US201213693151 |
申请日期 |
2012.12.04 |
申请人 |
TOKYO ELECTRON LIMITED;TOKYO ELECTRON LIMITED |
发明人 |
HIRAKAWA OSAMU;HONDA MASARU;FUKUTOMI AKIRA;TAMURA TAKESHI;HARADA JIRO;NODA KAZUTAKA |
分类号 |
B32B38/10 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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