发明名称 Integrated circuit diode
摘要 A method includes forming isolation regions in a semiconductor substrate to define a first field effect transistor (FET) region, a second FET region, and a diode region, forming a first gate stack in the first FET region and a second gate stack in the second FET region, forming a layer of spacer material over the second FET region and the second gate stack, forming a first source region and a first drain region in the first FET region and a first diode layer in the diode region using a first epitaxial growth process, forming a hardmask layer over the first source region, the first drain region, the first gate stack and a portion of the first diode layer, and forming a second source region and a second drain region in the first FET region and a second diode layer on the first diode layer using a second epitaxial growth process.
申请公布号 US8482078(B2) 申请公布日期 2013.07.09
申请号 US201113104542 申请日期 2011.05.10
申请人 CHENG KANGGUO;KHAKIFIROOZ ALI;KULKARNI PRANITA;SHAHIDI GHAVAM G.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHENG KANGGUO;KHAKIFIROOZ ALI;KULKARNI PRANITA;SHAHIDI GHAVAM G.
分类号 H01L21/70 主分类号 H01L21/70
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