| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a connection structure between an electronic substrate and a housing becomes large and complicated and sufficient cooling efficiency is not attained when heat from a heating element mounted on the electronic substrate detachably attached to the housing is radiated to the exterior.SOLUTION: A housing 210B houses an electronic substrate 100F having a plate like substrate 110 where a heating element 120 may be mounted. A cooling structure is provided in the housing 210B and includes a heat reception part 220A, a heat radiation part 230A, and a heat transmission part 700. The heat reception part 220A receives heat generated in the heating element 120. The heat radiation part 230A radiates the heat generated in the heating element 120. The heat transmission part 700 connects the heat reception part 220A with the heat radiation part 230A and transmits the heat generated in the heating element 120 from the heat reception part 220A to the heat radiation part 230A. The heat reception part 220A has a first joint surface 225 thermally connected with the heating element 120. |
