A system comprises a first integrated circuit (IC) chip that includes a first electronic component; a second IC chip that includes a second electronic component; a through silicon via (TSV) in the second IC chip that electrically couples the first electronic component to the second electronic component; and a signal gating transistor that fully occludes the TSV.
申请公布号
US8492903(B2)
申请公布日期
2013.07.23
申请号
US201113171919
申请日期
2011.06.29
申请人
BARTLEY GERALD K.;GERMANN PHILIP R.;PAULSEN DAVID P.;SHEETS, II JOHN E.;INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BARTLEY GERALD K.;GERMANN PHILIP R.;PAULSEN DAVID P.;SHEETS, II JOHN E.