| 摘要 |
PROBLEM TO BE SOLVED: To provide a cured film obtained by thermosetting a resin composition, which is improved in adhesion with a metal film (metal wiring layer).SOLUTION: A treatment method of a cured film includes: subjecting a cured film, which is formed by applying a resin composition containing an alkali-soluble resin and a silicone compound on a substrate, to oxygen plasma treatment followed by reverse sputtering, and continuously forming films of a barrier metal and Cu thereon in this order. In that case, the surface roughness (Ra2) of the surface of the cured film after reverse sputtering, as measured by an atom force microscope (AFM), is 35% or more and 95% or less of the surface roughness (Ra1) thereof before reverse sputtering. |
