| 摘要 |
A system and method by which thickness of a dielectric film on substrates can be noninvasively determined is invented. The system and method are especially applicable to areas and applications where traditional techniques have proven unsuccessful or limited. According to embodiments of the present invention the present system and method can be used to measure film thickness in confined and inaccessible locations, and on substrates of complex geometry. The method can be used with an arbitrary and time varying orientation of the substrate-film interface. The measurements of the film thickness on the inside of open or enclosed channels of an arbitrary geometry, and on flexible substrates are possible. With multiple embedded sensors, the film thickness in different lateral locations can be simultaneously measured. The dielectric permittivity of the FUT as a function of the distance from the substrate of the film can also be measured.
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