发明名称 Multi-layered circuit structure
摘要 An enhanced multi-layered structure is disclosed including an N number of inductor layers (N is an integer greater than one). Each inductor layer includes a substrate and at least one spiral inductors situated on the substrate. The inductor layers may be stacked and aligned with each other so that the electromagnetic fields of the spiral inductors on different inductor layers overlap (at least partially). The spiral inductors on the various inductor layers may be electrically coupled to each other so as to act at an overall inductor. The substrates may be very thin to reduce losses, increase the inductance, and lower the resistance of the overall inductor. The enhanced structure may further include ground planes disposed on top of and below the N inductor layers to provide shielding for the inductor layers. This enhanced structure enables a low loss, high Q inductor to be implemented in a high-performance circuit.
申请公布号 US8519815(B1) 申请公布日期 2013.08.27
申请号 US201113196739 申请日期 2011.08.02
申请人 SANDERS GARY L.;TIVO INC. 发明人 SANDERS GARY L.
分类号 H01F5/00;H01F27/28 主分类号 H01F5/00
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