发明名称 |
RADIATION CURABLE AND THERMOSETTABLE RESIN COMPOSITION, AND DRY FILM SOLDER RESIST |
摘要 |
<p>The present invention relates to: a radiation curable and thermosettable resin composition enabling provision of a dry film solder resist having a higher glass transition temperature and improved heat resistance; and a dry film solder resist. The resin composition can comprise: an acid-modified oligomer comprising an iminocarbonate-based compound having a carboxyl group (-COOH) and a radiation curable unsaturated functional group; a photopolymerizable monomer having two or more radiation curable unsaturated functional groups; a thermosettable binder having a thermosetting functional group; and a photoinitiator.</p> |
申请公布号 |
WO2013125854(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
WO2013KR01339 |
申请日期 |
2013.02.20 |
申请人 |
LG CHEM, LTD. |
发明人 |
KU, SE-JIN;CHOI, BYUNG-JU;JEONG, WOO-JAE;CHOI, BO-YUN;LEE, KWANG-JOO;JEONG, MIN-SU |
分类号 |
C08L101/02;C08F283/02;C08L69/00;G03F7/004;G03F7/028 |
主分类号 |
C08L101/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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