发明名称 |
FLUX FOR LEAD-FREE SOLDER, LEAD-FREE SOLDER PASTE AND LEAD-FREE WIRE SOLDER |
摘要 |
PROBLEM TO BE SOLVED: To provide a flux composition having satisfactory wettability, and in which cracks are hard to be generated on flux residue.SOLUTION: A flux for lead-free solder including dimer acid dialkyl ester (A) is used. The flux further includes rosins (B): an activator (C); a thixotropic agent (D); a solvent for a flux (E); and an antioxidant (F). |
申请公布号 |
JP2013173184(A) |
申请公布日期 |
2013.09.05 |
申请号 |
JP20130009493 |
申请日期 |
2013.01.22 |
申请人 |
ARAKAWA CHEM IND CO LTD |
发明人 |
ODA TAKESHI;KUBO NATSUKI;ISHIGA FUMIO |
分类号 |
B23K35/363;B23K35/14;B23K35/26;C22C13/00;C22C13/02 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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