发明名称 FLUX FOR LEAD-FREE SOLDER, LEAD-FREE SOLDER PASTE AND LEAD-FREE WIRE SOLDER
摘要 PROBLEM TO BE SOLVED: To provide a flux composition having satisfactory wettability, and in which cracks are hard to be generated on flux residue.SOLUTION: A flux for lead-free solder including dimer acid dialkyl ester (A) is used. The flux further includes rosins (B): an activator (C); a thixotropic agent (D); a solvent for a flux (E); and an antioxidant (F).
申请公布号 JP2013173184(A) 申请公布日期 2013.09.05
申请号 JP20130009493 申请日期 2013.01.22
申请人 ARAKAWA CHEM IND CO LTD 发明人 ODA TAKESHI;KUBO NATSUKI;ISHIGA FUMIO
分类号 B23K35/363;B23K35/14;B23K35/26;C22C13/00;C22C13/02 主分类号 B23K35/363
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