| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining apparatus, by which a workpiece can be cut completely without cutting a protecting member, to which a workpiece is stuck, along a division scheduling line that is formed on the workpiece even when there is a variation in the thickness of a workpiece such as a wafer, and also, by which a laminate that is laminated on a substrate can be surely cut.SOLUTION: In a laser beam machining method, a laser beam machining groove is formed on a workpiece by emitting the laser beam onto the workpiece at a plurality of times, the wavelength of plasma which is generated by emitting the laser beam onto the workpiece is detected, and when only a plasma beam having a first wavelength is detected, the emission of the laser beam is continued, and when a plasma beam having a second wavelength is detected, the emission of the laser beam is stopped after the emission of the laser beam is continued to the terminal of the laser beam machining groove that is being machined. |
