| 摘要 |
<p>Provided is a power conversion apparatus, which is capable of having the whole configuration thereof reduced, while efficiently cooling a semiconductor power module. The power conversion apparatus is provided with a semiconductor power module (4), and a cooling body (3), which is disposed on one surface side of the semiconductor power module, and which cools the semiconductor power module. The cooling body (3) is provided with: a chamber (13), which is provided to face the position where the semiconductor power module is attached, which circulates a cooling medium, and which has long sides facing each other, and short sides facing each other; a cooling medium supply section (14), which supplies the cooling medium to one long side of the chamber (13); and a cooling medium discharge section (15), which discharges the cooling medium from the other long side of the chamber.</p> |
