发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable compound semiconductor device which achieves reliable normally-off without causing damage to a compound semiconductor laminate structure.SOLUTION: AlGaN/GaN HEMT comprises on an SiC substrate 1, a compound semiconductor laminate structure 2 and a gate electrode 9 formed above the compound semiconductor laminate structure. In a lower region position matched with the gate electrode 9 of the compound semiconductor laminate structure 2, a p-type impurity (Mg) and oxygen (O) are localized to a depth where a part of a two dimensional electron gas generated in the compound semiconductor laminate structure 2 dissolves.
申请公布号 JP2013197305(A) 申请公布日期 2013.09.30
申请号 JP20120062708 申请日期 2012.03.19
申请人 FUJITSU LTD 发明人 YAMADA ATSUSHI
分类号 H01L21/338;H01L21/205;H01L21/306;H01L21/336;H01L29/778;H01L29/78;H01L29/786;H01L29/812 主分类号 H01L21/338
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