| 摘要 |
PROBLEM TO BE SOLVED: To inhibit the movements of voids formed in a through-hole conductor.SOLUTION: A planar conductor 11c is formed on a first surface F1 of a substrate 10, and a planar conductor 12c is formed on a second surface F2 of the substrate 10. Further, the substrate 10 has a through hole 10h, and a through-hole conductor 10c connecting the planar conductor 11c with the planar conductor 12c is provided in the through hole 10h. The interior of the through-hole conductor 10c includes a void V1. An insulation layer 20 is formed on the first surface F1 of the substrate 10 and the planar conductor 11c. A conductor pattern 21c is formed on the insulation layer 20. Multiple openings 20h exposing parts of the planar conductor 11c are provided at the insulation layer 20, and a via conductor 20c connecting the planar conductor 11c with the conductor pattern 21c is formed in each opening 20h. |
