POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE

摘要

This power module substrate (10) is provided with an insulating substrate (11), a circuit layer (12) formed on one surface of the insulating substrate (11), and a metal layer (13) formed on the other surface of the insulating substrate (11). The circuit layer (12) is composed of copper or a copper alloy, and an electronic component (3) is mounted on one surface of the circuit layer (12). The metal layer (13) is configured by joining together aluminum plates comprising aluminum or an aluminum alloy. The thickness (t1) of the circuit layer (12) is set within a range of 0.1 mm <= t1 <= 0.6 mm, and the thickness (t2) of the metal layer (13) is set within a range of 0.5 mm <= t2 <= 6 mm. The relationship between the thickness (t1) of the circuit layer (12) and the thickness (t2) of the metal layer (13) is established such that t1 < t2.