| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that, the gold plating has good solder wettability and can be easily solder mounted, but because of good solder wettability the melted solder is transmitted to gold plated surface, a soldering face spreads more than needed, which may result in product deficiency, when gold plating is applied to contact points of connectors of electronic components and the like.SOLUTION: On the part which needs a solder barrier belt, printing is performed beforehand by an ink jet to prevent from generating gold plating. Even if the whole is put into a plating tank, according to the masking effect of ink jet ink, gold plating is not generated onto the portion of ink. A solder barrier belt can be formed by removing the ink later. Since the ink jet printing can perform printing to minute parts, and due to non-contact the printing can be performed also on a stereo configuration, the printing can also be performed onto a complicated configuration or a stereo surface to form a solder barrier belt. |
