发明名称 Dual Profile Shallow Trench Isolation Apparatus and System
摘要 The presented principles describe an apparatus and method of making the same, the apparatus being a semiconductor circuit device, having shallow trench isolation features bounding an active area and a periphery area on a semiconductor substrate to electrically isolate structures in the active area from structures in the periphery area. The shallow trench isolation feature bounding the active area is shallower than the shallow trench isolation feature bounding the periphery area, with the periphery area shallow trench isolation structure being formed through two or more etching steps.
申请公布号 US2013277790(A1) 申请公布日期 2013.10.24
申请号 US201213454924 申请日期 2012.04.24
申请人 HUNG CHIA-YANG;CHEN PO-ZEN;YANG SZU-HUNG;JENG CHIH-CHERNG;CHAO CHIH-KANG;CHENG I-I;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HUNG CHIA-YANG;CHEN PO-ZEN;YANG SZU-HUNG;JENG CHIH-CHERNG;CHAO CHIH-KANG;CHENG I-I
分类号 H01L29/06;H01L21/762 主分类号 H01L29/06
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