| 摘要 |
A sensor device includes an IC chip, a package which includes a base in which the IC chip is provided and houses the IC chip, the base having a through hole provided in a position that overlaps with the IC chip in the plan view, and a spacer which is provided between the IC chip and the base, and has an aperture communicating the through hole with the space on the opposite side to the base with respect to the IC chip in the package between the IC chip and the space.
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