| 摘要 |
An apparatus and a method for cleaning a chuck table are provided to reduce a cost by preventing a periodic replacement or adjustment of the chuck table by preventing damage or abrasion of a porous material in cleaning the chuck table and to improve quality variation of the wafer due to abrasion and the minute hole clogging of the porous material. A chuck table(100) is composed of a porous member(110) and a chuck case(120) receiving the porous material. A chuck table cleaning device includes a cleansing material feeding unit, and a vacuum suction unit(300). The cleansing material feeding unit supplies the cleansing material to the lower part of the porous material through the flow channel formed in the chuck case. The vacuum suction unit is arranged in an upper direction of the chuck table to reciprocate. The vacuum suction unit sucks the foreign material remaining in the upper portion of the chuck table. |
