发明名称 Method for forming coil in circuit board for e.g. highly efficient bus system, involves forming helical conductor at inner wall of hole for formation of coil in circuit board, where helical conductors are wound around longitudinal axis
摘要 <p>The method involves providing a circuit board (1), and setting a HDI plated-through hole (6) into the circuit board (S1) along a longitudinal axis (7). Helical conductors are formed at an inner wall (9) of the hole for the formation of the coil in the circuit board and wound around the longitudinal axis. The circuit board is drilled along the longitudinal axis for setting the hole and provided with two conductor planes (4, 5), where the hole reaches from the conductor plane to another conductor plane. An internal thread (8) is pressed or sectioned on the inner wall of the hole. An independent claim is also included for a circuit board.</p>
申请公布号 DE102012207833(A1) 申请公布日期 2013.11.14
申请号 DE201210207833 申请日期 2012.05.10
申请人 BAYERISCHE MOTOREN WERKE AKTIENGESELLSCHAFT 发明人 KAINDL, MICHAEL;VODIUNIG, ROBERT;POELLOTH, HORST
分类号 H05K3/40;H05K1/16 主分类号 H05K3/40
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