| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which satisfies all of high thermal conductivity, high tensile adhesion strength, high handleability and working efficiency, and high safety, and is suitable for adhesive application of a floor heating panel.SOLUTION: A moisture-curable adhesive composition contains: 100 parts mass of a polyoxyalkylene polymer having 1.5 or more crosslinkable silyl groups in one molecule thereof and 4,000-30,000 number-average molecular weight (Mn); and 400-700 parts mass of a thermally conductive filler. It is preferable that the number of the crosslinkable silyl groups contained in one molecule is 1.5-5 and the crosslinkable silyl group is shown by general formula (1) (wherein R is a 1-20C substituted or unsubstituted univalent organic group and Rs can be the same or different from one another when a plurality of Rs exist; X is a hydroxyl group or a hydrolyzable group or Xs can be the same or different from one another when a plurality of Xs exist; n is an integer of 1-3). |
