发明名称 METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE AND APPARATUS FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a nitride semiconductor substrate and an apparatus for manufacturing a nitride semiconductor substrate, which are capable of improving in-plane uniformity of a substrate temperature in a step of epitaxially growing a carrier supply layer on a support substrate.SOLUTION: The method for manufacturing a nitride semiconductor substrate includes the steps of: preparing a tray having a mounting surface which is overall parallel to a second substrate main surface of a nitride semiconductor substrate in which layer formation has been performed up to a carrier supply layer deposited while heating a support substrate; arranging a new support substrate on the tray so that its second substrate main surface faces the mounting surface; and epitaxially growing a nitride semiconductor layer on a first substrate main surface of the new support substrate mounted on the tray.
申请公布号 JP2013239588(A) 申请公布日期 2013.11.28
申请号 JP20120111791 申请日期 2012.05.15
申请人 SANKEN ELECTRIC CO LTD;SHIN ETSU HANDOTAI CO LTD 发明人 SATO KEN;GOTO HIROICHI;SHIKAUCHI HIROSHI;TSUCHIYA KEITARO;SHINOMIYA MASARU;HAGIMOTO KAZUNORI
分类号 H01L21/205;C23C16/34 主分类号 H01L21/205
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