发明名称 |
METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE AND APPARATUS FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a nitride semiconductor substrate and an apparatus for manufacturing a nitride semiconductor substrate, which are capable of improving in-plane uniformity of a substrate temperature in a step of epitaxially growing a carrier supply layer on a support substrate.SOLUTION: The method for manufacturing a nitride semiconductor substrate includes the steps of: preparing a tray having a mounting surface which is overall parallel to a second substrate main surface of a nitride semiconductor substrate in which layer formation has been performed up to a carrier supply layer deposited while heating a support substrate; arranging a new support substrate on the tray so that its second substrate main surface faces the mounting surface; and epitaxially growing a nitride semiconductor layer on a first substrate main surface of the new support substrate mounted on the tray. |
申请公布号 |
JP2013239588(A) |
申请公布日期 |
2013.11.28 |
申请号 |
JP20120111791 |
申请日期 |
2012.05.15 |
申请人 |
SANKEN ELECTRIC CO LTD;SHIN ETSU HANDOTAI CO LTD |
发明人 |
SATO KEN;GOTO HIROICHI;SHIKAUCHI HIROSHI;TSUCHIYA KEITARO;SHINOMIYA MASARU;HAGIMOTO KAZUNORI |
分类号 |
H01L21/205;C23C16/34 |
主分类号 |
H01L21/205 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|