发明名称 Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board
摘要 A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.
申请公布号 US8604354(B2) 申请公布日期 2013.12.10
申请号 US20090645191 申请日期 2009.12.22
申请人 ITO SHOJI;KITADA TOMOFUMI;OMINATO TADANORI;FUJIKURA LTD. 发明人 ITO SHOJI;KITADA TOMOFUMI;OMINATO TADANORI
分类号 H05K1/02 主分类号 H05K1/02
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