| 摘要 |
In a manufacturing technique for packaged semiconductor devices, a pre-form of a packaged semiconductor device is formed by a molding process which encapsulates the semiconductor device and its associated heat transfer component in a passivating material presenting a surface. The surface is then processed to at least remove excess passivating material and expose the heat transfer component. The processing may further remove a portion of the heat transfer component. The removal process may, for example, utilize a grinding and/or polishing process. The process may be controlled so as to expose or form a heat transfer surface of desired shape and size. |
