| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of reliably mounting a lead component Pl to a substrate S by bringing a lead l into proper contact with a clinch device 100 and sufficiently bending the lead l even when a position relationship between an insertion hole h of the substrate S and the clinch device 100 is not proper.SOLUTION: A lead receiving member 120 is displaced in a plane orthogonal to a component mounting direction D by a force received from a lead l contacting the lead receiving member 120. When a position relationship between an insertion hole h of a substrate S and a clinch pin 100 is not proper, a force corresponding to this position relationship acts on the lead receiving member 120 from the lead l, and the lead receiving member 120 is displaced in the plane orthogonal to the component mounting direction D. Accordingly, the position relationship between the lead receiving member 120 and the insertion hole h is improved properly. As a result, the lead l is brought into proper contact with (the lead receiving member 120 of) the clinch pin 100 and the lead l is sufficiently bent, and therefore, a lead component Pl can be reliably mounted to the substrate S. |
