| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which can reduce deformation of a connection wire associated with expansion and shrinkage of a silicone resin which are caused by a temperature change.SOLUTION: An optical semiconductor device OS1 comprises: an optical semiconductor chip 1; a circuit chip 2; a chip connection wire 4 for connecting the optical semiconductor chip 1 and the circuit chip 2; a package 3A having a housing part for housing the optical semiconductor chip 1 and the circuit chip 2; and a silicone resin 5 filled in the housing part so as to cover the optical semiconductor chip 1, the circuit chip 2 and the chip connection wire 4. The package 3A includes a projection 36 which is provided between the optical semiconductor chip 1 and the circuit chip 2 in a Y direction along which the optical semiconductor chip 1 and the circuit chip 2 are opposite to each other, and which projects from a bottom face of the housing part and is formed integrally with the package 3A. |
