| 摘要 |
A vacuum injection molding device, according to one embodiment of the present invention, comprises: a first mold which is connected to an injection nozzle so as to receive a resin; a second mold which is combined with the first mold so as to form an injection cavity; first and second sealing members which surround the outside of contact surfaces of the first mold and the second mold, and which come in close contact so as to be joined together; and a vacuum pump for forming the vacuum state of the injection cavity by discharging the gas of the injection cavity, wherein a gas discharge path is formed to be connected to the injection cavity through the first sealing member and/or the second sealing member and the vacuum pump discharges the gas of the injection cavity through the gas discharge path. |
