| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching protective material, along with a manufacturing method of a device substrate that uses the material, which provides by a method of simple and low cost, all of high resistance with respect to an etchant (alkaline and acid), heat resistance during processing, proper adhesion to a wafer applied with etching process, and ease in removing, after etching process. SOLUTION: The etching protective material comprises a polyolefin resin containing olefin component (A), comprising alkene of carbon number 2-4 as main component with (meth)acrylic acid ester component (B) contained by 2-40 mass%. COPYRIGHT: (C)2011,JPO&INPIT |
