| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball mounting device using a tare weight capable of improving reliability of mounting solder balls by solving such problems that the solder balls are pressed by a squeezer to fill an opening of a mask, or solder balls are collided with each other and surfaces are cracked to rapidly generate oxidation during squeezing, a solder ball mounting system including the same, and a solder ball mounting method using the same.SOLUTION: The solder ball mounting device according to the present invention includes: a table 100 on the upper face of which a printed circuit board 300 is mounted; position adjusting parts 131, 132 for inclining the table 100 in a right and left direction in contact with one side or both sides of the table 100; and a mounting mask 200 having respective openings 210 corresponding to respective pads of the printed circuit board 300, and overlaid and mounted on the table 100 via the printed circuit board 300 between it and the table 100. |
