| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat shock absorber which inhibits the effects of heat on other devices, and to provide a reflow furnace.SOLUTION: A heat shock absorber 6 includes a reflow furnace 4 which performs soldering of a substrate 5 and an electronic component, and discharges air of higher temperature than the external atmosphere from a carry-in port 3b of the substrate 5, a conveyor for conveying the substrate 5 between the reflow furnace 4 and other device provided in the pre-stage of the reflow furnace 4, and a heat sink 30 for taking the heat of the discharge air. |
