SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor device manufacturing method which can adequately clear a cleaning fluid and a cleaning residual from grooves formed on a surface of a semiconductor substrate while suppressing cost rise.SOLUTION: A semiconductor device comprises: a pattern groove 110 formed on a surface of a semiconductor substrate 1 in an element region 11 where semiconductor elements are formed; and dummy grooves 140 which are formed in a dummy region 12 on the surface of the semiconductor substrate 1 and connected to the pattern groove 110 on an outer periphery side of the semiconductor substrate 1 than the pattern grove 110 in a radial direction. A semiconductor device manufacturing method comprises: a process of forming a pattern groove 110 on a surface of a semiconductor substrate 1 in an element region 11; and a process of forming a dummy groove 140 on the surface of the semiconductor substrate 1 in a dummy region 12 on an outer periphery side of the semiconductor substrate 1 than the pattern grove 110 in a radial direction.