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发明名称
卡合结构及应用该卡合结构之电子装置
摘要
本发明提供一种卡合结构及应用该卡合结构的电子装置,该电子装置包括一机体、一盖体及设于机体和盖体之间的一装配件。所述卡合结构包括一卡合件及一定位销,该卡合件设于机体上,该卡合件包括至少一卡钩,该卡钩穿过装配件并卡持装配件,该定位销设于盖体上并抵持卡钩。
申请公布号
TWI428081
申请公布日期
2014.02.21
申请号
TW099127016
申请日期
2010.08.12
申请人
富士康(香港)有限公司 香港
发明人
李志慧;王世峰;陈冠宏
分类号
H05K7/12;G06F1/16
主分类号
H05K7/12
代理机构
代理人
虞彪 台北市中山区长安东路1段21号3楼
主权项
地址
香港
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