发明名称 |
Methods and apparatus for alignment in flip chip bonding |
摘要 |
Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment. |
申请公布号 |
US8664039(B2) |
申请公布日期 |
2014.03.04 |
申请号 |
US201113276162 |
申请日期 |
2011.10.18 |
申请人 |
SUNG MING-CHUNG;LIU YU-CHIH;LIN WEI-TING;LEE CHIEN-HSIUN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SUNG MING-CHUNG;LIU YU-CHIH;LIN WEI-TING;LEE CHIEN-HSIUN |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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