| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and the like, which can improve a fixing power for fixing a metal mask on a semiconductor device.SOLUTION: A semiconductor manufacturing apparatus of the present embodiment has a support substrate including a loading surface for loading a semiconductor device. The support substrate includes a plurality of magnets for fixing a mask structure having lattice-shaped line patterns on the semiconductor device which is loaded on the loading surface. The respective magnets are arranged below lattice points at each of which the line patterns cross each other, and arranged between the adjacent lattice points and below the line pattern in plan view. A maximum width of the magnet is wider than a width of the line pattern in plan view. The respective magnets are arranged such that a direction that links the N pole and the S pole faces a thickness direction of the semiconductor device and the adjacent magnets have polarities reversed from each other. |
