| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that can electrically connect circuit members favorably; and a semiconductor device, a multilayer circuit board, and an electronic component using the resin composition.SOLUTION: Provided is a resin composition that adheres circuit members and is used to electrically connect electric circuit electrodes which the respective circuit members have, and that has a flux function. The resin composition includes: an epoxide resin; and a compound having flux activity, wherein a refraction index of the epoxide resin at 20°C is at most 1.56. Permeability of visible light of a coated film is preferably at least 30% in a state in which a hardening reaction ratio of a resin composition component included in the coated film formed by 100 μm of a film thickness using the resin composition is at most 40%. |
