发明名称 ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic apparatus which has excellent heat radiation efficiency of a heating component and inhibits local increase of a surface temperature of a housing body.SOLUTION: An electronic apparatus 100 includes: a housing 40; a circuit board P; and a heat conduction sheet 101. The circuit board P is attached to the interior of the housing 40. Electronic components 50, 51, 52, 53 are mounted on the circuit board P, and metal cases 61, 62 are attached onto the circuit board P. The heat conduction sheet 101 includes: enclosing parts 110, 111, 112; and a plane part 120. On the heat conduction sheet 101, the enclosing parts 110, 111, 112 protrude to the circuit board P side relative to the plane part 120. Surfaces of the enclosing parts 110, 111, 112 at the circuit board P side are joined to the electronic component 51 and the metal cases 61, 62. A surface of the heat conduction sheet 101 which is opposite to the circuit board P is joined to an inner surface of the housing 40.
申请公布号 JP2014049536(A) 申请公布日期 2014.03.17
申请号 JP20120189934 申请日期 2012.08.30
申请人 MURATA MFG CO LTD 发明人 TAMAYA YASUHIRO
分类号 H05K7/20;H01L23/373;H04M1/02 主分类号 H05K7/20
代理机构 代理人
主权项
地址