发明名称 Semiconductor device and manufacturing method thereof
摘要 According to one embodiment, a semiconductor device includes an element region partitioned by an isolation region in a semiconductor substrate, and a source region and a drain region formed in a surface layer of the element region by being isolated by a gate trench along a predetermined direction across the element region. The semiconductor device includes a gate electrode formed to reach a position deeper than the source region and the drain region by embedding at least part thereof in the gate trench with a gate dielectric film interposed therebetween. An interface in the drain region, which is in contact with the gate dielectric film, includes a projection projecting toward the gate electrode side.
申请公布号 US8680612(B2) 申请公布日期 2014.03.25
申请号 US201213601400 申请日期 2012.08.31
申请人 IZUMIDA TAKASHI;AOKI NOBUTOSHI;KABUSHIKI KAISHA TOSHIBA 发明人 IZUMIDA TAKASHI;AOKI NOBUTOSHI
分类号 H01L29/10;H01L29/423;H01L29/78 主分类号 H01L29/10
代理机构 代理人
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