| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film suitable for a board for a high definition (fine pitch) circuit such as for COF, capable of reducing dimensional changes in a width direction (TD) of the polyimide film while maintaining a thermal expansion coefficient (CTE) approximated to a copper wiring in a machine transportation direction (MD) of the polyimide film, and to provide a copper-clad laminate using the same as a base material.SOLUTION: A board for a COF for a tablet terminal contains a polyimide film in which fine particles having a particle diameter of 0.07 to 2.0 μm are dispersed uniformly and having a thickness of 26.5 to 36.5 μm as a base material, and on which copper wiring having the thickness of 1 to 10 μm is formed, and the polyimide film is manufactured by using one or more aromatic diamine selected from a group consisting of paraphenylene diamine, 4,4'-diaminodiphenyl ether and 3,4'-diaminodiphenyl ether, and one or more acid anhydride selected from a group consisting of pyromellitic dianhydride and 3,3'-, 4,4'-diphenyl tetracarboxylic acid dianhydride. |
